SCIMOS H DCL

Range
Fused cast
Subtitle

Void-free, electrofused 94% alumina (beta alumina)

Description

High creep-resistance material unaffected by alkali vapor environments.
Void-free structure enabling longer lifetime.

Typical application

The void-free, electrofused 94% alumina (beta alumina), SCIMOS H DCL solution is specific to superstructure application.

Downstream part of the superstructure in high quality glass furnaces, including crowns.

Chemical and physical properties

Microstructure

Image
Microstructure of SCIMOS H

Typical chemical composition

 

Typical crystallographic analysis

 

Physical characteristics

Description International standards British standards
Refractoriness under load of 2.105 Pa 1,750°C 3,182°F
Cold crushing strength >50Mpa >7,251psi
Typical bulk density 3.0g/cm3 187pcf

Storage

The void-free, electrofused 94% alumina (beta alumina), SCIMOS H DCL solution must be stored in a dry environment protected from weather conditions.

Related products

Fused cast

Void-free, electrofused 92% alumina (beta alumina)

High creep-resistance material unaffected by alkali vapor environments.
Void-free structure enabling longer lifetime.

Fused cast

Regular cast, electrofused 94% alumina (beta alumina)

High creep-resistance material and neutrality to alkali vapor environments.

Fused cast

Void-free, electrofused 95% alumina (alpha-beta alumina)

Excellent glass contact properties with extremely low defect potential.
High resistant to alkali vapor and creep for superstructure application.
Void-free structure enabling longer lifetime.

Fused cast

Void-free, electrofused 95% alumina (alpha-beta alumina)

Excellent glass contact properties with extremely low defect potential.
High resistant to alkali vapor and creep for superstructure application.
Void-free structure enabling longer lifetime.

Fused cast

Regular cast, electrofused 95% alumina (alpha-beta alumina)

Excellent glass contact properties with extremely low defect potential.
High resistant to alkali vapor and creep for superstructure application.