Repair Chips AZS

Range
Repair Materials
Subtitle

This product is particularly suited for urgent bottom repairs without glass drain

 

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SEFPRO CARE Repair Chips AZS 3D Website

Repair Chips AZS can be used to repair furnaces without stopping production or emptying the furnace, which makes this solution particularly economical.

The manufacturing process and its specific packaging eliminates all fine particles, thereby preventing pollution of glass and permitting a rapid return to normal glass quality.

Typical application

Repair Chips AZS are designed for hot repair operations in container, flat, pharmaceutical, and reinforcement glass furnaces. They are especially suited for glass furnace bottom. 

Advantages

Adapted packagingNet bags are sturdy, easy to open, easy to handle, and guarantee continuous elimination of fine particles, ensuring the integrity of the glass during repairs.
LongevityThe use of electro-fused AZS grains gives the product unique corrosion resistance properties.
Glass compatibilityAZS grains are fully compatible with all types of glass needing repair operations

Chemical and physical properties

Microstructure

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SEFPRO CARE Microstructure Premix Alumina

Typical chemical composition

 

Physical characteristics

DescriptionInternational standardBritish standard
Bulk Density3.7 T/m3 231.2pcf
Diameter of Chips30-60mm1.2 to 2.4 inches

Storage

  • 1,000Kg Big Bag (2,204lbs): Polypropylene bags
  • 1,040Kg Wooden Box (2,292.8lbs): NIMP15

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